Packaging defects have always been a key factor limiting yield improvement, especially in the fields of high-density interconnects and micro pitch mounting, which require higher precision, stability, and automation capabilities of equipment. The ASMPT solidification machine has significant advantages in reducing packaging defect rates and has been widely validated in various packaging forms.

The core mounting module adopts a high-resolution intelligent vision system with multiple alignment recognition capabilities, which can automatically correct micrometer level errors between chips and substrates, significantly reducing mounting offset and virtual soldering problems. Equipped with dynamic pressure control technology, it ensures that the pressure during each solidification action is uniform and consistent, avoiding quality defects such as chip damage, glue overflow, or empty bonding.

In addition, the ASMPT solidification machine supports multiple packaging defect warning and traceability mechanisms. The real-time image processing system automatically captures abnormal mounting states, determines defect types through AI algorithms, and outputs process suggestions. Engineers can quickly adjust parameters based on this. Record and visualize the entire production process data to further reduce the occurrence of repetitive defects.

In high complexity scenarios such as high-precision SiP packaging and MEMS device solidification, the equipment exhibits strong adaptability with its stability and repeatability, and the batch yield can be stably maintained at over 99.5%. Multiple packaging and testing companies have reported that after upgrading the ASMPT solidification machine, the average packaging defect rate has decreased by about 40%, and the overall pass rate has significantly improved.

With its mechanical design, intelligent control, and process integration capabilities, ASMPT solidification machines have become an important equipment guarantee for manufacturing enterprises to improve product consistency and reduce defect rates.