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Bestsoon Electronic Technology Co., Ltd.

Tel: +86-755-23016560

Contact : Mr. zhao

Mobile : +86 139 2573 3686

Fax: +86-755-23016560

E-mail:sales@bestsoon-china.com


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Address : 2302, 23rd Floor, Jinhao Building, No. 109, Fuyong Section, Guangshen Road, Fenghuang Community, Fuyong Street, Bao'an District, Shenzhen

Regarding the principle and operating steps of the LED die bonder,what does the LED-ASM die bonder do?

2019-05-22 11:40:18
Times

What does the LED die-bonding machine do? The principle and operating steps of the LED die-bonding machine are new knowledge that we bring to you today. With the development of the times, the emergence of the die-bonding machine is also particularly important to the electronic products in our lives, and there may be many People don’t know what a die bond machine is, so let’s take a look at it.


What does the LED die bonding machine do?

The LED die-bonding machine is a professional model for die-bonding LED products. It adopts computer control and is equipped with a CCD image sensor system. The CCD system scans first to determine the correct path, and then enters the programmed program and easily presses the button. The whole operation process can be realized: firstly, the product that requires die-bonding is die-bonded on the fixture, dotted with red glue, the LED is drawn through the suction nozzle, and then the LED is fixed on the product. What needs attention is that the product after die-bonding Fortunately, Yuguang's active die-bonding machine can finish curing within 1 to 2 hours.


The principle of LED die bonding machine:

It is the working position where the PCB board is transferred to the fixture by the feeding organization, and the glue-dispensing organization first dispenses the position where the PCB needs to be bonded to the chip. Then the bonding arm moves from the origin position to the pick-up wafer position. The wafer is placed on the expander wafer tray supported by the film. After the bonding arm is in place, the suction nozzle moves downward and moves upward to lift the wafer. After picking up the wafer, the bonding arm returns to the original position, and the bonding arm moves from the original position to the bonding position. After the suction nozzle bonds the wafer down, the bonding arm returns to the original position again. This is a complete bonding process.


ASM Bonding Machine

Operation steps of LED die bonding machine:

1. The loading organization transfers the PCB board to the working position of the fixture. First, the dispensing organization dispenses the position of the PCB to be bonded to the chip, and the Xinyichang active die bonder dispenses, and then the bonding arm moves from the original position to Pick up the wafer orientation and place the wafer on the expander wafer tray supported by the film. After the bonding arm is in place, the suction nozzle moves downwards and moves upward to lift the wafer. After picking up the wafer, the bonding arm returns to the original position (the orientation of missing wafer detection), The bonding arm then moves from the original position to the bonding position, the nozzle is downwardly bonded to the wafer, and the bonding arm returns to the original position again. This is a complete bonding process.


2. When the active die-bonding machine completes one cycle, the next position data of the wafer is detected by machine vision, and the data is transmitted to the wafer disk motor, and the next wafer is moved to the alignment after the motor completes the corresponding distance. The orientation of the pick-up wafer.


3. The glue and bonding position of the PCB board is the same process, until all the glue positions on the PCB board are bonded to the chip, and then the PCB board is removed from the workbench by the transfer organization, and a new PCB board is installed. Start a new Cuitao Xinyida wire bonding machine operating cycle.


How to adjust the parameters of the LED die bonding machine if the LED die is broken?

The height of the nozzle and die height of the machine are directly controlled by the parameters in the machine computer. Large parameters, small absorption height; small parameters, large absorption height, and whether the chip is damaged or not is directly affected by the machine's absorption height parameters. The main reasons for the undesirable phenomena are: large machine parameters, low fixing height, excessive force on the chip, and chip damage.


Adjust the machine parameters to appropriately increase the height of the alert nozzle or the height of the die. Adjust the height of the nozzle in the "Pick Level" item in the "Bond head menu" in the "SETUP" form of the machine, and then adjust the height of the nozzle in the second item "Bond Level" adjusts the height of the solid crystal.


What does the LED die-bonding machine do? The principle and operation steps of the LED die-bonding machine have been brought to everyone. Friends who need to know the die-bonding machine can come to the road for consultation and understanding. We have professional staff to answer you.

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01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2302, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen