As my country has gradually become a global LED packaging base, my country's LED packaging industry has developed rapidly, and the requirements for packaging equipment have gradually increased. There are many packaging processes and various types of sophisticated equipment (such as ASM mini LED production equipment) are required. The following is a brief analysis of the main equipment required for LED packaging, as well as the market and technology.

Abstract: As my country has gradually become a global LED packaging base, my country's LED packaging industry has developed rapidly, and the requirements for packaging equipment have gradually increased. There are many packaging processes and various types of sophisticated equipment are required. The following is a brief analysis of the main equipment, market, and technology required for LED packaging.

During the ten years from 2008 to 2017, my country's LED packaging market has undergone earth-shaking changes. At present, my country has become a global LED packaging base, with packaging output value close to 70% of the world. In the development process, LED packaging technology has continued to break through, and the market scale and market structure of packaging equipment have undergone significant changes.

Packaging equipment market size and competition

From the perspective of market size, the number of packaging equipment has increased year by year, and the number has increased to more than 100,000 units in 10 years. As of 2017, my country's packaging equipment has reached 150,000 units. With the development of the LED industry, the scale of the industry has shown a rapid growth trend, with a compound annual growth rate of double digits. However, after the rapid development, the industry's growth rate has experienced a brief decline. The packaging equipment industry has developed relatively stable in recent years.

From the perspective of the competitive landscape, domestic packaging equipment has achieved a step from following the development of foreign countries to gradually competing with foreign production equipment in the market, and occupying a certain market share. In recent years, part of my country's LED packaging equipment has gradually realized import substitution, and the domestic market penetration rate has gradually increased.

Main equipment market and technology development

In terms of equipment, LED packaging equipment mainly includes die-bonding machines, glue dispensers, wire bonding machines, taping machines, beam splitters, etc. Among these major equipment, in addition to wire bonding machines, domestically produced glue dispensers, die bonding machines, and splitter taping machines have more revenue in the domestic market than foreign packaging equipment. The current market revenue of LED packaging equipment is about 3-4 billion yuan.

Among these equipments, foreign suppliers such as ASM, KNS, Canon, etc. were the main ones in the early stage. The above three manufacturers accounted for most of the domestic market in the development of LED packaging equipment. After the development of domestic enterprises, the competitiveness of some equipment with loose precision requirements or key technologies that are easier to break through has gradually increased. For example, die-bonding machines, glue dispensers, and splitter taping machines have reached 90% of the newly added volume. However, the current domestic replacement rate of wire bonding machines is low. At present, the level of development of domestically produced wire bonding machines is relatively low, and the products are more in the low-end range. In the future, if the LED packaging equipment makes breakthroughs in the process and accuracy of the test, it will be in the market. There is great potential for development.

(1) Dispenser

At present, there are more than 200 domestic companies producing dispensers, and the equipment in the dispensing field has been almost completely domestically produced. The main brands on the market include EFD from the United States, JANOME and IEI from Japan, and domestically produced OAMAY, ANTAIX, Weites, Keyida, Ruixin Office and Lewei. At present, domestic manufacturers of automatic dispensers are mainly concentrated in the Pearl River Delta. In recent years, the demand for dispensers in my country has grown rapidly. In 2017, the market demand for dispensers in my country was about 282,000, and the average price of each dispenser gradually dropped to 50,200 yuan. The market size reached 14.16 billion yuan, a year-on-year increase from 2016. 11.5%.

At present, the scale of my country's dispensing machine industry is small, with many small and medium-sized enterprises and scattered industrial resources. In addition, the technical level of domestic automatic dispensers is not high, the level of independent innovation needs to be improved, and the level of industry development still needs to be improved.

(2) Bonding machine

As domestic packaging manufacturers have higher and higher precision requirements for die-bonding machines, and at the same time lower and lower price requirements, domestic LED die-bonding machine equipment manufacturers are ushering in development opportunities. In addition, domestic manufacturers have greatly improved their technology and solution capabilities, and their stability, output, and output value are not inferior to imported manufacturers. They have reached or even exceeded the level of the same imported die-bonding machine in terms of speed and accuracy, so domestic die-bonding machines have replaced them. Imports have become a trend. At present, the domestic manufacturer Xinyichang has a relatively high market share of LED die-bonding machine equipment, of which the white light market share is 90%, the COB market share is 80%, the RGB market share is 80%, and the CSP market share is 50%.

However, the homogeneity of domestic die-bonding machine products is serious and price competition is fierce. In the future, it is necessary to improve product customization capabilities according to customer needs, enhance product core competitiveness, and improve product after-sales service.

(3) Wire bonding machine

At present, the LED packaging industry generally adopts fully automatic wire bonding machines, because manual and semi-automatic wire bonding machines are difficult to meet market demand in terms of production capacity and efficiency. They have been gradually replaced by fully automatic wire bonding machines, but they will be used for patching in the short to medium term. The auxiliary equipment is still indispensable.

The full-automatic wire bonding machine has a higher technological content and requires a higher technical level. Due to the weak technology and insufficient innovation of domestic companies in this regard, imported fully automatic wire bonding machines occupy most of the domestic market share and continue to maintain high prices, which have become an important obstacle to the development of China's LED market. At present, domestic wire bonding machines have 30% price space compared with foreign brands. If domestic manufacturers achieve breakthroughs in technology and accuracy, the market space is huge. As far as manufacturers are concerned, Birui, etc., as one of the few domestic manufacturers that can produce fully automatic wire bonding machines, still has a certain gap in wire bonding speed compared with imports. It will take several years or even longer to realize domestic substitution on a large scale like die-bonding machines, glue dispensers and other LED packaging equipment.

Among the wire bonding machines, the gold wire bonding machine is the key equipment that has not achieved a breakthrough at present. Its difficulty lies in its high productivity and high precision at the same time, and the requirements for the process are very strict. Domestic equipment has a large gap compared with foreign countries in terms of high-resolution XY motion platform, state head accuracy, high-speed thermosonic bonding process, ultra-low arc welding capability, and multi-layer arc welding capability. Product stability and yield, etc. Not as good as foreign equipment.

(4) Spectroscopic taping equipment

In the main equipment required for LED packaging, the technical difficulty of the LED splitter tape is relatively low, the price is low, and the profit level is low. The company mainly achieves a disguised price reduction by improving the performance. Fierce competition has promoted the continuous improvement of the localization rate of LED spectroscopic taping machines. At present, the localization of LED spectroscopic taping machines exceeds 90%.

The current market scale of LED spectroscopic taping machines will stabilize at around 400 million. The market structure has gradually become clear. The number of companies in the industry has gradually decreased to less than ten, and there are fewer than five companies with stable shipments. Among them, Xuanshuo Optoelectronics and Chaoyang Technology are the two companies with large shipments in my country. Both of them ship. The volume exceeds 60% of the total market demand.

Equipment development trend

In terms of the market, the LED industry is currently in a period of steady development, and the market growth rate of the LED packaging equipment industry has declined. It is expected that the growth rate of my country's LED packaging equipment market will fluctuate between 10%-15% from 2018 to 2020.

In terms of technology, LED packaging equipment is developing towards high speed, high precision, extreme size and intelligence. The die bonder and dispenser need to be further improved in speed. The die bonder UPH needs to develop from 20K to 40K and 60K, and the dispenser UPH needs to develop from the current 30K, 40K to 100K to increase production capacity. At the same time, the positioning accuracy of XY must be improved. At present, the accuracy of the two directions of Y and X is about 30-40um, and the next step is to develop in the direction of 10-15um. In addition, in terms of a wide range of sizes, the die bonder needs to develop from the commonly used 4-6 inches to 8 inches or even 12 inches, while the glue dispenser and wire bonding machine must be developed towards miniaturization.

The key technology of packaging equipment research and development includes dynamic analysis and optimization of die bonding mechanism under high acceleration (>15g); high-speed gentle bonding mechanism, motion generation, micro-force control, precision control; powder-glue two-phase optical medium rheological properties, micro-nano Upgraded droplet formation mechanism, optimized flow channel, multi-energy field (heat, friction, deformation, phosphor silica gel damping) dynamic model of spray needle movement; high-speed equipment (>40k) online detection and fault analysis system, etc.

Not only limited to the development of existing equipment, with the advancement of technology, new packaging equipment should also emerge. For example, after the production of flip chip technology, eutectic soldering machines and solder paste soldering machines appeared; high-power COB high-density packaging drove the development of dam dispensers and COB spectrometers; EMC and ceramic packaging must be applicable in the future The equipment for it appeared. In addition, CSP packaging technology has also led to the emergence and development of fluorescent film forming equipment and film pressing equipment.

Conclusion

At present, the number of LED packaging equipment is increasing year by year, but the growth rate has slowed down, and the development of the industry is relatively stable. The domestic packaging equipment has achieved a step from following the development of foreign countries to gradually competing with foreign production equipment in the market, and occupying a certain market share. Among them, glue dispensers, die bonding machines, and spectroscopic taping equipment have made great progress in domestic substitution. But high-end wire bonding machines still need to be imported. With the iteration of technology, packaging equipment will continue to develop, and new packaging equipment will gradually appear.