The development of integrated circuit packaging equipment is driven by market and technology. The localization should be led by chip design manufacturers. Chip design drives manufacturing packaging and testing, and manufacturing packaging and testing drives equipment materials to create an atmosphere that encourages innovation. At present, the overall technical level of my country's integrated circuit equipment industry is not high, core product innovation capabilities are not strong, and the overall equipment is still in the low-end and other problems. The progress of the equipment industry is a long and gradual process. On the one hand, we must continue to catch up with the gap in the current level. On the other hand, with the continuous emergence of new designs and new processes, we must make efforts in advanced packaging technology and equipment customization requirements. It provides a stage for domestically-made equipment to flex its muscles. Only by seizing the opportunity of technological development trends can domestically-made equipment make a breakthrough.

At present, there is no truly large and strong packaging equipment company in my country. The next development of China's integrated circuit packaging equipment is worth pondering. The author puts forward suggestions from the following aspects:

 First, vigorously support the development of core equipment components, form cooperation with leading domestic companies in related fields, and set up major national special projects to support core component research and development; 

second, platform-level companies vigorously introduce high-end talents and The team, especially the leader of an international packaging equipment leader, creates a relaxed environment that is conducive to the development of talents, and builds a collaborative innovation system with enterprises as the main body, universities and scientific research institutions as the support, and mutual promotion of production, education, research and application; 

the third is to establish The continuous policy-oriented process-equipment ecosystem consortium for collaborative innovation is composed of domestic end users, design, manufacturing, packaging and testing, materials, equipment and other complete integrated circuit industry chain upstream and downstream companies, using the resources and resources of leading companies in each industry chain Technological advantages, joint research and development of advanced technologies;

 the fourth is to strengthen capital operation, deep integration, share resources, improve technology research and development and innovation capabilities, strengthen and expand enterprises, equipment enterprises can use mergers and acquisitions to enhance their competitiveness, expand living space and reduce costs , To save research funds, thereby opening up the upstream and downstream links of the industry.

Take the research and development of a domestic 12-inch wafer dicing machine as an example. The 12-inch dicing machine has the characteristics of multi-chip cutting, high efficiency, high precision, and labor cost saving. Domestic packaging companies urgently need inexpensive and high-quality 12-inch wafer dicing. machine. With the support of the national “02 Special Project”, Beijing Zhongdian Electronic Equipment Co., Ltd. has invested in the research and development of a 12-inch dicing machine since 2014, breaking through the biaxial structure table bridge technology, large diameter and thin wafer transfer technology, and high rigidity gas Key technologies such as floating spindle technology and tool mark recognition and analysis system design. At the end of 2017, the process verification was completed in Suzhou Jingfang. After one year of technology accumulation in 2018, it achieved important technological breakthroughs and market breakthroughs in 2019, realized mass production, and signed a contract value of more than 10 million yuan.