With the acceleration of the localization process of packaging materials, more and more electronic manufacturing enterprises are paying attention to the compatibility issues between equipment and domestic materials. As a global packaging equipment brand, whether ASMPT solidification machines can adapt to domestic lead frames, silver paste, conductive adhesives and other materials has become a topic of concern in the industry.

The ASMPT solidification machine has a highly open material adaptation capability and adopts a multidimensional adaptive process platform. Through parameter adjustable solidification pressure control, intelligent visual calibration system, and multi-level temperature control mechanism, it can process different types of domestic packaging materials. Especially when using domestically produced low odor silver paste and low-temperature conductive adhesive, the equipment exhibits stability and consistency. The embedded material database supports custom formula adjustment, and engineering personnel can fine tune the solidification process according to material properties, effectively improving the assembly yield.

In practical cases, multiple companies using domestically produced BGA substrates and wafer adhesives have provided feedback that ASMPT die bonding machines operate stably during mass production without significant yield fluctuations. The equipment platform supports SPC process control, which can monitor installation deviations and pressure fluctuations in real time, reducing packaging defects caused by changes in material physical properties.

At the same time, ASMPT continues to conduct joint verification tests with multiple domestic packaging material companies, continuously optimizing the compatibility of equipment under local material conditions. The ability to support domestic material applications from the device side provides key support for the domestic substitution of semiconductors.

Against the backdrop of an increasingly evident trend towards localization of packaging materials, ASMPT solidification machines have become one of the preferred equipment for domestic material packaging production lines due to their highly compatible, stable operation, and continuously optimized system architecture.