As irregular structured semiconductor devices, the mounting process of irregular shaped chips places higher demands on solid-state equipment. The ASMPT die bonding machine, with its modular structure design and highly intelligent control system, can meet the high-precision mounting requirements of various shaped chips and is widely used in packaging scenarios such as sensors, optoelectronic devices, MEMS modules, etc.

The device is equipped with a multi axis degree of freedom motion platform, combined with a visual image adaptive recognition system, which can perform contour recognition and pose adjustment on non rectangular chips. By customizing the picking trajectory and multi angle mounting program, the layout of complex chips on high-density packaging boards can be achieved, effectively avoiding the problems of misalignment and poor contact in traditional equipment during the mounting of irregular chips.

The solidification process introduces intelligent path planning and automatic compensation technology for adhesive volume. The system can automatically adjust the dispensing position, quantity, and path according to the chip shape, ensuring that each irregular component obtains suitable solidification process parameters. The pressure control unit is synchronized and linked, intelligently adjusting the thrust size based on the actual force surface of the chip to prevent device damage or internal stress concentration.

The ASMPT solidification machine also supports rapid changeover of irregular chips. The embedded process template management system can establish independent parameter packages for different chip forms, reducing manual debugging time and improving the efficiency of multi variety mixed production. The system supports integration with mainstream MES systems to achieve traceable full process management of irregular components.

In the context of the increasing frequency of use of irregular chips in the packaging industry, ASMPT die bonding machines have become an important technical guarantee for packaging companies to layout diversified product structures due to their adaptability and engineering reliability.