Domestic machinery and equipment are advancing rapidly, and the gap with imported equipment is gradually narrowing. At the same time, many LED companies have begun to experiment with new models such as machine substitution and fully automatic production lines to explore the possibility of intelligent manufacturing. Where will the growth space of equipment companies be in the future? ? Has become the focus of close attention in the industry nowadays. The entire LED industry is gradually moving from a growth period to a mature period. With the further expansion of the industrial scale, the field of supporting manufacturing equipment is also improving day by day.

It is understood that the current LED manufacturing equipment mainly includes five core parts: front-end die bonding, wire bonding, dispensing, and back-end light splitting and taping. In traditional thinking, equipment is always better from foreign manufacturers, but after the rapid advancement of domestic enterprise technology in recent years, the gap between domestic equipment and imported equipment is gradually narrowing. At the same time, in recent years, in the face of high cost pressures, many LED companies have begun to experiment with machine substitutions and fully automated production lines to explore new models of ‘smart’ manufacturing.

So, from the packaging equipment in the middle reaches of the industry to the automation equipment of lamps and lanterns in the downstream, China has become the main production base of LED packaging devices in the world. At the same time, with the increase in the volume of packaging companies, the demand for LED packaging equipment is increasing. At present, the localization rate of LED packaging equipment in my country is rapidly increasing year by year. In terms of LED packaging equipment, the previous market pattern was that ASM die-bonding machine imported equipment manufacturers accounted for the market share of the LED packaging equipment industry.

Led packaging equipment ASM products are divided into three categories: the category is ASM automatic die-bonding machines for the LED front-mounted market, such as AD819-LD and AD819-PD. The main features are high speed, high precision, and speeds up to 70K/H; second This type is a dual-point glue-bonding machine for flip-chip and LED. There are eight models of this type. The main feature is that it is equipped with a dedicated dual-dispensing mechanism for flip-chip. It has good glue dot consistency, no glue, fast speed, and parameters. Adjust the size and distance of the glue dot, especially suitable for the ultra-small glue dispensing required by different sizes of flip chip dispensing and photoelectricity. The single head speed of the flip chip dual dispensing mechanism can reach 23K/H; The material bonding machine set a precedent in the industry, realizing a new model of the whole roll bracket bonding. The third category is die-bonding machines for diodes and ICs. There are currently six different models for different products.

Specifically for flip-chip technology and flip-chip LEDs, a dual dispensing mechanism and a vertical die attach mechanism have been developed. The dual dispensing mechanism is based on the characteristics of flip-chip products, the state of solid-liquid separation of solder beads and flux in the solder paste, and various flip-chips of different sizes. The two glue points need to adjust different distances, and the size of the two glue points is consistent. Highly demanding features, specially designed and optimized. On the basis of ensuring the above high requirements, it can also ensure that the speed is basically the same as that of the formal product, and at the same time ensure that the flip chip is not damaged. Therefore, the production efficiency and quality of the flip chip product are greatly improved, and the competitiveness of the flip chip product is improved. In addition, another major feature of the double-dispensing mechanism is that there is no glue connection and the consistency of the glue dots. This is also the function developed by Weitianxing specifically for flip-chip LED products, which can realize ultra-small double glue dots with ordinary dispensing needles. , Good glue point consistency, low cost of accessories and long life.

The LED die-bonding machine is a professional model for die-bonding LED products. It is controlled by a computer and equipped with a CCD image sensor system. The CCD system scans first to determine the correct path, and then enters the programmed program and easily press the button. The whole work process can be realized: firstly, the product that needs to be die-bonded is solidified on the fixture, dotted with red glue, the LED is sucked through the suction nozzle, and then the LED is fixed on the product. It should be noted that the solidified product can be cured within 1 to 2 hours.