Die Bonder is a key equipment in the semiconductor packaging process, used to pick up and place chips from the blue film or frame onto the substrate or pin holder. During this process, the nozzle is an important component used by the solidification machine to pick up chips. The choice of nozzle directly affects the picking efficiency and placement accuracy of the chip, so it is crucial to choose the correct nozzle size.

The selection of nozzle size is mainly based on the following factors:

Chip size: The nozzle size needs to match the chip size. Normally, the diameter of the nozzle should be slightly larger than the MAX diameter of the chip to ensure that the nozzle can completely cover the chip and prevent it from slipping during the picking process.

Chip shape: In addition to considering the size of the chip, the shape of the chip also needs to be taken into account. For example, square, circular, or chips with special shapes may require customized suction nozzles to ensure gripping effectiveness.

Material properties: Different chip materials have different surface characteristics, such as smoothness, hardness, etc., which can affect the adsorption force between the nozzle and the chip. Therefore, this also needs to be considered when choosing the material of the nozzle.

Pick up stability: In order to ensure the stability of the chip during the picking process, the design of the suction nozzle also needs to consider the ability of vacuum adsorption. A too small nozzle may cause unstable adsorption, while a too large nozzle may affect placement accuracy.

Placement accuracy: During the chip placement stage, the size of the suction nozzle can also affect the placement accuracy. A size adapted nozzle can help achieve positioning.

Production efficiency: Suitable suction nozzles can improve the picking speed of chips, thereby enhancing overall production efficiency.

In practical operation, engineers will choose the appropriate nozzle size based on specific chip specifications and production process requirements. In addition, with the advancement of technology, some solidification machines are now equipped with automatic adjustment functions, which can automatically replace or adjust the suction nozzle according to different chips to meet the production needs of various chip types. For complex production environments, it may be necessary to combine practical experience and experimental data to determine the size of the suction nozzle.