Solid state machines play a vital role in the semiconductor packaging industry and are mainly used to pick up and place chips (die) from wafers into position on leadframes or substrates. However, during operation, the solid state machine may encounter problems with crystal pickup failures, which not only leads to lower productivity, but also increases scrap rates. The following are some common causes of crystal pickup failure and their possible solutions:

Ejector pushes up the top height is not enough: If the height of the ejector is not set properly, can not effectively chip from the blue film or wafer top up, it will lead to crystal absorption failure. The solution is to adjust the height of the ejector pin to ensure that it is just able to top the blue film without damaging the chip.

Suction time is too short: If the crystal suction time is set too short, the vacuum nozzle may not have enough time to adsorb the chip, resulting in crystal suction failure. Extending the suction time can improve this problem.

Three-point deviation: The alignment of the nozzle, thimble and camera needs to be accurate. If all three are not in the same straight line, it may result in chips not being picked up or placed correctly. Aligning the position of the camera, thimble and nozzle to ensure that all three coincide can solve this problem.

Sensor sensitivity is too high or malfunctioning: improperly set or malfunctioning sensitivity of the missing die sensor may result in false alarms or failure to detect the chip. Adjusting the sensitivity of the inductor or replacing the damaged inductor can solve the problem.

Insufficient vacuum strength: the vacuum system is the key to crystal suction, if the vacuum strength is not enough, the chip can not be firmly adsorbed on the suction nozzle. Check the performance of the vacuum pump to ensure that the vacuum channel of the crystal suction thimble is unobstructed.

Mismatch between the chip and the nozzle: The size or shape of the chip does not match the nozzle, which may also lead to crystal suction failure. This can be avoided by using a nozzle that is matched to the chip.

Worn or broken ejector pins: Worn ejector pins may not be able to effectively eject chips, while broken pins may not work at all. Regular inspection and replacement of worn or damaged ejector pins is necessary.

Nozzle contamination: Contaminants on the surface of the nozzle can reduce its adsorption capacity. Clean the nozzle regularly to ensure that its surface is clean and free of contaminants.

Obstacles in the pick-and-place path: Any obstacles in the pick-and-place path will prevent the chips from moving properly. Remove obstructions to ensure a clear path.

Damaged or mismatched nozzles: Damaged nozzles do not create enough vacuum for adsorption, and mismatched nozzles may not fit the size and shape of the chip. Check and replace damaged nozzles to ensure the correct type of nozzle is used.

Solving the problem of failed vacuum pickup in a solidification machine usually requires a combination of the above factors, careful inspection of the equipment and appropriate adjustments to ensure its proper operation.