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Bestsoon Electronic Technology Co., Ltd.

Tel: +86-755-23016560

Contact : Mr. zhao

Mobile : +86 139 2573 3686

Fax: +86-755-23016560

E-mail:sales@bestsoon-china.com

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Address : 2202, 23rd Floor, Jinhao Building, No. 109, Fuyong Section, Guangshen Road, Fenghuang Community, Fuyong Street, Bao'an District, Shenzhen

Common problem analysis and adjustment methods of wire bonding machine

2024-09-29 15:13:59
Times

Wire bonder is one of the key equipment in semiconductor packaging and microelectronics manufacturing, used to establish electrical connections between chips and pin frames or substrates. The working principle of the wire bonding machine is to use ultrasonic energy to solder metal wires such as gold and aluminum wires between the pads and pins of the chip, forming a reliable electrical connection. During use, the wire bonding machine may encounter some common problems that may affect welding quality and production efficiency. Here are some common problems and their adjustment methods:

Common problems and adjustment methods

Bonding Failure

Reason: It may be due to insufficient wire tension, inappropriate welding head pressure, incorrect welding parameter settings, and other reasons.

Solution: Check and adjust the tension of the welding wire to ensure that the welding head pressure is appropriate, and adjust the welding parameters (such as ultrasonic energy, welding time, etc.) according to the specific situation.

Misalignment of solder joints

Reason: Usually caused by inaccurate positioning of the welding head or unstable welding wire path.

Solution: Calibrate the position of the welding head to ensure accurate positioning; Check and adjust the wire guide device to ensure a stable wire path.

Insufficient solder strength (Weak Bonds)

Reason: It may be caused by improper welding parameter settings or poor welding wire quality.

Solution: Adjust welding parameters, such as increasing ultrasonic energy, extending welding time, etc; Check the quality of the welding wire to ensure it meets the standard requirements.

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Cracks in Bonds

Reason: During the welding process, it may be caused by excessive pressure or excessive ultrasonic energy.

Solution: Reduce the pressure of the welding head and ultrasonic energy appropriately to ensure that there is no damage to the solder joint.

Irregular Bond Formation formed by solder joints

Reason: It may be caused by a mismatch between the diameter of the welding wire and the welding setting, or unstable vibration of the welding head.

Solution: Adjust welding parameters according to the diameter of the welding wire to ensure stable vibration of the welding head.

Slow Bonding Speed

Reason: Unreasonable welding parameter settings or improper equipment maintenance.

Solution: Optimize welding parameters, regularly maintain equipment, and ensure that all components operate normally.

Wire breakage

Reason: Excessive tension of the welding wire, quality issues with the welding wire, or poor movement of the welding head.

Solution: Adjust the tension of the welding wire, use qualified welding wire, and ensure smooth movement of the welding head.

Summary of Adjustment Methods

Regular calibration: Regularly calibrate the welding line machine to ensure its positioning accuracy and welding parameter accuracy.

Parameter optimization: Continuously adjust and optimize welding parameters based on actual production conditions to achieve welding results.

Equipment maintenance: Regularly maintain the welding line machine, check the wear of each component, and replace worn parts in a timely manner.

Welding wire quality management: Strictly control the quality of welding wire to ensure that it meets the production process requirements.

Through the above methods, most of the problems encountered during the use of the wire bonding machine can be effectively solved, improving welding quality and production efficiency. If the problem still exists or is difficult to solve, it is recommended to contact the equipment manufacturer or professional technical personnel for further diagnosis and treatment.


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01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen