SD8312 Automatic Soft Solder Die Bonding System
Feature
●The new generation SD8312 series establishes a new standard for 12" soft tin die bonding
●Universal work table design, which can handle high-density lead frames
●High-speed die bonder combining innovative high technology and mature technology
●Precisely control the oxygen level during die bonding
●AB wafer processing capacity
Size
Width, depth and height
1,950 x 1,600 x 1,400 mm³