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Automatic Soft Solder Die Bonding System

2021-03-24 11:12:50
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Automatic Soft Solder Die Bonding System
Content:

SD8312 Automatic Soft Solder Die Bonding System


Feature


●The new generation SD8312 series establishes a new standard for 12" soft tin die bonding


●Universal work table design, which can handle high-density lead frames


●High-speed die bonder combining innovative high technology and mature technology


●Precisely control the oxygen level during die bonding


●AB wafer processing capacity



Size


Width, depth and height


1,950 x 1,600 x 1,400 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen