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ASMPT Automatic Die Bonding System (12” wafer handling)

2023-12-19 17:41:09
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ASMPT  Automatic Die Bonding System (12” wafer handling)
Content:

ISLinDA Automatic Die Bonding System (12” wafer handling)


Feature


●High-density lead frame processing capability


●Independent control of crystal fetching and die bonding system


●Patent thin crystal processing system


●Panel bonding ability



Size


Width, depth and height


2,280 x 1,610 x 2,385 mm³

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01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen