AD211 Plus ASMPT Automatic Direct Eutectic Die Attach System

Feature

●Accuracy ± 12.5 µm @ 3s

●Can directly process ceramic substrates

●Patented technology and modular design

●Independent control of crystal fetching and die bonding system

● Equipped with IQC system to provide real-time graphical statistical data

●With preheating zone and cooling zone to prevent thermal shock

●Provide an oxygen-free solid crystal environment

●Trace the source of materials and strengthen quality control

●Optional multi-crystal die-bonding

Size

Width, depth and height

2,080 x 1,270 x 2,080 mm³