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Automatic Die Bonding System (8” wafer handling)

2021-03-24 11:11:49
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Automatic Die Bonding System (8” wafer handling)
Content:

AD832i Automatic Die Bonding System (8” wafer handling)


Feature


●Ultra-micro dispensing capability


●Ultra-small wafer processing capacity


●High-density lead frame processing capability


●Patented welding head design


●Double glue system


●The new IQC system provides real-time graphical statistics



Size


Width, depth and height


1,740 x 1,350 x 1,506 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen