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ASMPT Automatic Die Bonder

2023-12-19 17:41:17
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ASMPT Automatic Die Bonder
Content:

AD830P-Plus ASMPT Automatic Die Bonder


Feature


●High-speed, high-precision die bonding


●Polycrystalline LED processing capability


●Top-view lens to identify the PN electrode at the bottom of the chip


●Poly crystal arm module (option)


●Brand new image recognition system


●At the time of glue dispensing and die bonding, image recognition and inspection are carried out at the same time to improve production efficiency


●"PR On The Fly" top-view image recognition capability, which can improve the precision of die bonding position without losing the die bonding cycle time


●Option: Downward-looking lens for double-sided image inspection of the chip


●Realize factory automation


●Fully automatic material handling capability


●Fully automatic wafer handling system (option)


●Connectivity (option)



Size


Width, depth and height


1,740 x 1,240 x 2,080mm

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen