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Automatic Epoxy Die Attach System (6” wafer handling)

2021-03-24 11:10:40
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Automatic Epoxy Die Attach System (6” wafer handling)
Content:

AD830 Plus-R Automatic Epoxy Die Attach System (6” wafer handling)


Feature


●Patented welding head design


●High-density lead frame processing capability


●Using arranging optical system to further increase the die bonding speed


●A full-color camera equipped with white light LED lighting, which can handle different substrates


●Tape and reel material handling capacity (only applicable to AD830Plus-R)


●8” wafer processing capacity (option)



Size


Width, depth and height


1,740 x 1,240 x 2,080mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen