AD830 Plus Automatic Epoxy Die Attach System (6” wafer handling)
Feature
●Patented welding head design
●High-density lead frame processing capability
●Using arranging optical system to further increase the die bonding speed
●A full-color camera equipped with white light LED lighting, which can handle different substrates
●Tape and reel material handling capacity (only applicable to AD830Plus-R)
●8” wafer processing capacity (option)
Size
Width, depth and height
1,740 x 1,240 x 2,080mm³