NUCLEUS Series Multi-Purpose Precision Pick & Place Tool

Feature

●A pioneer in wafer-level fan-out technology and embedded packaging

●Support flip chip and direct die bonding modes, and perform local alignment and overall alignment

●Extra large substrate processing capacity

●Support super large die bonding pressure and hot pressing die bonding process

● Equipped with automatic tool conversion system to realize polycrystalline die bonding process

●The die-bonding process meets the cleanliness level 100 requirements

●NUCLEUS-XL: Extra large substrate processing capacity

Size

Width, depth and height

1,460 x 2,300 x 2,100 mm³