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Automatic High Precision Die Attach System

2021-03-24 11:08:49
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Automatic High Precision Die Attach System
Content:

Photon Automatic High Precision Die Attach System


Feature


●Accuracy ± 3 µm @ 3s


●Glue/spray glue solid crystal


●Automatic nozzle replacement capability (up to 6 nozzles)


●Multi-needle thimble system, which can handle different size wafers


●Trace the source of materials and strengthen quality control


●Patented welding head design


●Options


●Polycrystal ability


●UV curing



Size


Width, depth and height


2,150 x 1,400 x 2,300 mm

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen