NOVA Plus ASMPT Bonding Machine and Compounding Machine

Feature

●Accuracy ± 2.5 µm @ 3s

●Die die cycle <3 seconds

●The machine is designed in module type, suitable for all micro packaging applications

●Using eutectic die-bonding by laser or heating plate, or die-bonding with glue/spray

●Multi-chip multi-chip die-bonding

●Wafer positioning

●Inspection and measurement after die bonding

●Working range of substrate 550 x 600 mm

●Active die bonding strength control

●Automatic loading of materials, up to

●12" wafer

●300 mm wafer

●450 mm substrate wafer

●Options

●UV curing

●Glue

Size

Width, depth and height

1240 x 2140 x 1980 mm