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ASMPT Bonding and Compounding Machine

2023-12-19 17:56:16
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ASMPT Bonding and Compounding Machine
Content:

NOVA Plus ASMPT Bonding Machine and Compounding Machine


Feature


●Accuracy ± 2.5 µm @ 3s


●Die die cycle <3 seconds


●The machine is designed in module type, suitable for all micro packaging applications


●Using eutectic die-bonding by laser or heating plate, or die-bonding with glue/spray


●Multi-chip multi-chip die-bonding


●Wafer positioning


●Inspection and measurement after die bonding


●Working range of substrate 550 x 600 mm


●Active die bonding strength control


●Automatic loading of materials, up to


●12" wafer


●300 mm wafer


●450 mm substrate wafer


●Options


●UV curing


●Glue



Size


Width, depth and height


1240 x 2140 x 1980 mm

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen