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ASMPT Automatic Die Bonding System (12” wafer handling)

2023-12-19 17:55:11
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ASMPT Automatic Die Bonding System (12” wafer handling)
Content:

AD8312 Plus Series ASMPT Automatic Die Bonding System (12” wafer handling)


Feature


●The new generation of high-capacity AD8312 series die bonder sets a new standard for the industry


●Universal work table design, suitable for processing high-density lead frames


●A variety of configurations are available to cater for the different needs of the market


●AD8312Plus: High-speed die bonder combining innovative high technology and mature technology


●AD8312SD: Large chip solution


●AD8312FC: Support flip chip and direct die bonding process



Size


Width, depth and height


2,260 x 1,580 x 2,060 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen