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ASMPT automatic die bonder system

2023-12-19 17:55:21
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ASMPT automatic die bonder system
Content:

AD819 Series Fully Automatic ASMPT Bonding System


Feature


●TO-can packaging processing capacity


●Accuracy ± 15 µm @ 3s


● Eutectic die bonding process (AD819-LD)


●Dispensing and bonding process (AD819-PD)

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen