AD838L-G2 ASMPT Automatic Die Attach System

Feature

●Accuracy ± 10 µm @ 3s

●Double dispensing/dispensing ability

●Direct ceramic substrate feeding

●The anvil is equipped with clip pressure self-compensation design

●Equipped with intelligent overall alignment, which can handle panel bonding

●Trace the source of materials and strengthen quality control

●Optional multi-crystal die-bonding

Size

Width, depth and height

1,930 x 1,440 x 2,080 mm³