产品banner
your current location : Home >> News >> Industry Information

Contact usContact Us

Bestsoon Electronic Technology Co., Ltd.

Tel: +86-755-23016560

Contact : Mr. zhao

Mobile : +86 139 2573 3686

Fax: +86-755-23016560

E-mail:sales@bestsoon-china.com

website:en.bestsoon-china.com

Address : 2202, 23rd Floor, Jinhao Building, No. 109, Fuyong Section, Guangshen Road, Fenghuang Community, Fuyong Street, Bao'an District, Shenzhen

What is the adaptability of ASMPT solidification machine to raw materials?

2024-10-29 23:59:58
Times

ASMPT solidification machines demonstrate strong compatibility for different types of chips.Whether it is small-sized microchips or large-sized special function chips,the die bonding machine can accurately perform picking and die bonding operations.It can adapt to various shapes of chips,including square,circular,rectangular,etc.,and can easily handle chips of different thicknesses.For chips made of different materials,such as silicon chips,compound semiconductor chips,etc.,the solidification machine adjusts the pressure,vacuum degree,and motion parameters of the suction nozzle to ensure that the chips are not damaged during operation,while ensuring the accuracy and quality of solidification.

ASMPT solidification machine

On the other hand,ASMPT solidification machines also have good adaptability when facing different substrate materials.Whether it is a traditional PCB substrate,or a special material substrate such as ceramic substrate or flexible substrate,the die bonding machine can fix the chip in place.For substrates with different surface characteristics,such as smooth surfaces,rough surfaces,or substrates with special coatings,the solidification machine can optimize the vision system and motion control algorithms to ensure that the chip can be firmly attached to the substrate without any adverse phenomena such as offset or warping.

In addition,the ASMPT solidification machine can also adapt to different solder and adhesive materials.For various types of conductive adhesives,insulating adhesives,and solder pastes,the solidification machine can adjust the solidification process parameters according to the characteristics of the materials,such as solidification pressure,heating temperature,and time,to ensure a firm and reliable connection between the chip and the substrate.At the same time,the advanced control system of the solidification machine can monitor parameter changes in real-time during the solidification process and make timely adjustments to ensure adaptability to different raw materials and stability of solidification quality.

Overall,ASMPT solidification machines,with their advanced technology and flexible design,are adaptable to various raw materials and provide reliable solidification solutions for the electronic manufacturing industry.


Recently Viewed:

Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen