ASM WIRE WELDER ASM Pacific technology: constantly adjust the development direction of advanced packaging technology, just over the 2021, the global semiconductor industry has experienced a lot of stories. On the one hand, the ever-spreading chip shortage has brought great trouble to the whole semiconductor industry and great challenge to the global semiconductor ecosystem. On the other hand, the rise in demand for semiconductor products related to telecommuting, accelerated growth in data centers, artificial intelligence, 5G communications, and new energy vehicles has helped fuel the Semiconductor industry boom. How will the Semiconductor industry develop in 2022? When can global supply chain shortages be alleviated? How can governments promote support for Semiconductor industry development? These are the concerns of the industry. “Semiconductor Chip Technology”magazine Special Launch-“New Year Outlook (2022 Outlook)”interview, invited to Asm Pacific Technology Co. , Ltd. , xu Zhiwei, vice president and Fan Junhao, shared their analysis and views on these issues.

About Asm Pacific Technology Ltd..ASMMPacificcTechnologyyLtd.. . ASM Pacific Technologies, Inc. (ASMPT) is the world’s largest supplier of integrated and packaged equipment for the semiconductor and light-emitting diode industry, provides assembly equipment and materials (etched and stamped lead frames) for multinational chip manufacturers, independent integrated circuit (IC) assembly plants, consumer electronics and LED manufacturers. Founded in 1975 and listed in Hong Kong in 1989, ASMPT now operates in more than 30 countries and regions and employs about 16,000 people. We have excellent research centers in Hong Kong, Taiwan, Chengdu, Singapore, Munich, Weymouth, Bringen, Portugal and other places. We also have advanced and intelligent manufacturing centers in Longgang, Shenzhen, Bao'an District, Guangdong, Hong Kong, Singapore, Malaysia and Germany. In 2011, ASMPT acquired the surface Mount Technology (SMT) division of Siemens AG in Germany, in 2014 it acquired the UK’s Dek stencil printing technology and the Netherlands’ALSI laser technology, and in 2018 it acquired the German technology company Amicra in Regensburg, the Portuguese developer of Critical Manufacturing software and the acquisition of the electrochemical deposition and Physical vapor deposition equipment in the Nexx Unit of Tel SEAS. In semiconductor integration and packaging equipment market, SMT solutions, radio frequency applications market, lead frame industry and other areas of global leadership and provide one-stop interconnection solutions.

According to the interviewer, Xu Zhiwei has been with ASM Pacific for 25 years and has held key positions in the technology and marketing departments respectively. Since 2006, he has focused on the business development of IC/D semiconductor market in China. He has established extensive customer contact network in the fields of IDM, OSATS, Fab and Fabless. With a deep understanding of the IC market, such as logic IC, analog IC, power IC, memory, MEMS, sensors, he is also actively involved in the company’s equipment development planning and process development. He received a Bachelor of Science Degree in physics and mathematics from the University of Hong Kong and a Master of Science Degree in physics from the Hong Kong University of Science and technology.

ASM Pacific Technology Co. , Ltd. , Xu Zhiwei Vice President (IC/D semiconductor solutions) SISC: Please look ahead to the global semiconductor industry in 2022. 2021 has been a very special year for the semiconductor industry, driven by a combination of the new crown epidemic and the localisation driven by a trade war between China and the US. New Technologies and market forces have also opened up new demand cycles -- 5G brings new market opportunities for electric and driverless cars, big data + data services, high-performance computing, data centers, artificial intelligence, the meta-universe, and the artificial intelligence Internet of things (Aiot) . New Material Technologies such as third-generation semiconductors (SiC, Gan, etc.) will enhance IGBT performance, and supply chains and wafer supplies are expected to remain tight in 2022, all of which will continue to dominate global semiconductor development in 2022. SISC: What challenges do you think China’s semiconductor industry is facing? In recent years, China has recognized the importance of the Semiconductor industry to achieve self sufficiency in the future. More investment and government support would help to accelerate the pace of development. Of course, China’s semiconductor development in the next few years may still have some challenges. Wafer Technology: restrictions on the import of lithography equipment (such as ASML) make it difficult for China to break through the technology of wafer nodes below 10nm, which is very important for advanced logic ics. China needs to make more efforts to achieve the same effect through advanced packaging (such as 2.5 d, 3 d) .IC DESIGN: Eda Software Licensing and intellectual property rights are controlled by the United States (such as Cadence, Synopsys, and Mentor Graphics) . LIST OF SEMICONDUCTOR MATERIALS: for example, chemical materials are more dependent on Japan and South Korea. Talent and resources: The Chinese market lacks experienced experts in advanced logic ICS, CPU/GPU and memory. It may take some time to develop and train the core team in China from technology to management. Excess capacity: According to the national localization plan, middle and low-end areas such as power supply, analog IC devices and consumer product applications will flourish in China, how to avoid the loss of value (and low profits) caused by overcapacity will be a key issue. HIGH-END SEGMENT MARKET: by the above factors, how to break through 5g/6g, electric vehicles, self-driving cars, AI and other fields, need a lot of advanced IC support, to win over the world’s major players need time. SISC: With Your Business, what do you think the supply chain will face in 2022? Shortages will continue, even if conditions are better than 2021. CUSTOMERS: Wafer shortages, supply constraints for lead frames and substrates are major barriers to capacity expansion. INSIDE: Long lead times for key components such as linear motion guides and motors will be a challenge for equipment suppliers. SISC: the National Semiconductor Industry support policies, you think how to fully benefit from this, which has a guiding role for Your Business Development?On the one hand, we see the government encouraging more local competition, which is our impetus to accelerate our development and win in the market. On the other hand, we can use more local resources to strengthen our made in China, train more local talents, make full use of our China R & D Center (ATC) in Chengdu, and cooperate with local market leaders and the China Semiconductor Association, this is very important for our future development. SISC: With the rapid development of 5G, AI, Iot and driverless technology in recent years, what are the new requirements or challenges for semiconductor manufacturing and packaging technology? How do you respond to these new requirements? All of these technologies require more advanced IC computing power, as well as advanced wafer technology. CPU/GPU/MCU is the key element of 5g/6g and AI technology, which makes it fully play the characteristics of high-speed, real-time and low-delay in the field of Internet of things, self-driving vehicle and AR/VR. According to Moore’s law, wafer nodes are approaching their limits, and advanced packaging (such as 2.5 d, 3 d) will become more and more important in the future packaging roadmap. This is the strength of Asm Pacific Ocean and the development focus in recent years, such as as as TCB, 2.5 d/3d high precision welding, laser application, Rdl, PVD/ECD and so on. SISC: What is Your Marketing Plan for 2022? China: is committed to the high-end market and the car market customers grow together. Working with leading players in advanced packaging (TCB, 2.5 d/3d) , logic (such as CPU, GPU, etc.) , and memory components, pROVIDE ASM Pacific complete solution xnexx ECD/PVD, laser cutting (ALSI) , solid crystal, solder wire, plastic seal, test, SMT complete solution. Overseas: working closely with IDM, wafer fab and chip design company to develop new packages.SISC: what is your technology or product plan for 2022? TCB welding equipment (Firebird) , high-precision pickup solution (Nucleus series) , wafer-level plastic packaging (ORCAS) , solid-crystal wire for memory solutions, third-generation semiconductor silver sintering solutions (such as SIC) . SISC: Looking back at 2021, what happened to the semiconductor industry as a whole? What have you achieved? We have achieved significant growth (revenue more than doubled) in the IC/SEPERATE component market and have successfully expanded our market share in the following areas: China’s major OSATS Chinese memory manufacturers, the power packaging market, iDM, OSATS and domestic customers, automotive market, especially China Electric Vehicle Market, power modules, silver sintering solutions, laser solutions (slotting and cutting) provide IDM with TCB and NEXX solutions to expand 2.5 d/3d solutions in IDM & amp; Fab House’s market share picture, interviews with guests, Mr Fan Junhao has been in the semiconductor industry for more than 30 years. He has held senior management positions at IDM/OSAT in Hong Kong and was the founder of a cooling technology company, and holds more than 40 patents related to semiconductor package technology. He was a graduate of the University of Colorado Colorado Springs and enrolled in the electronic engineering program.

ASM Pacific Technology Co. , Ltd. , Fan Junhao Vice President (advanced technology packaging) SISC: Please look ahead to the global semiconductor industry in 2022. It is expected to continue growing in 2022, by more than 5% over 2021. SISC: What challenges do you think China’s semiconductor industry is facing? Decoupling is one of the main challenges and an opportunity for the Chinese semiconductor market. Under decoupling, the technology supply is restricted to the Chinese market, which also leads to the necessity of the development of local technology supply chain and becomes the impetus to accelerate the growth of local technology supply chain capability. SISC: With Your Business, what do you think the supply chain will face in 2022? In 2022 and beyond, the market for semiconductor applications is very diverse. Our business focuses on drivers of market applications such as 5G communications, electric cars (EV) , IoT sensor technology, as well as Metaverse, Industry 4.0, advanced packaging technologies for high performance computing (HPC) and artificial intelligence. SISC: The National Semiconductor Industry Support Policies, you think how to fully benefit from this, which has a guiding role for Your Business Development? The national policy sends us a strong signal of the priority and commitment of China’s indigenous semiconductor industry. Over the years, the Chinese market has become one of our important target markets. Under the policy support, the Chinese semiconductor market will have the bigger growth, is more advantageous to us.SISC: With the rapid development of 5G, AI, Iot and driverless technology in recent years, what are the new requirements or challenges for semiconductor manufacturing and packaging technology? How do you respond to these new requirements? In addition to the typical goal of providing more cost-effective and reliable mass manufacturing (Hvm) solutions, we are aware of the need to constantly reorient our advanced packaging technology, to meet the country’s 5G, artificial intelligence, Internet of things and other applications of the unique needs. We have established a number of centres of innovation and core competencies around the world, bringing together technical experts at the international level. In addition, we continue to invest in research and development to ensure that our technology pipeline is filled with the tools necessary to make a difference in the right place at the right time. SISC: What is Your Marketing Plan for 2022? We plan to continue to increase our Market share in the locked Available Market while looking for opportunities to increase our SAM.SISC: what is your technology or product plan for 2022? We will continue to release new products and technologies to meet the requirements of 5G, AI, iot applications in automotive and power, application technologies and advanced packaging technologies. Especially in the field of advanced packaging technology, we will release advanced Hybrid bonding technology, next generation hot pressing technology (TCB) and wafer level and panel level fan out technology (WLFO & PLFO) to meet the new demand driven by heterogeneous integration technology. SISC: Looking back at 2021, what happened to the semiconductor industry as a whole? What have you achieved? Overall, 2021 was a year of significant growth in electronics and related components. 2021’s double digit year over year revenue growth, driven by strong demand across all product categories and sectors, is also very much in line with our market positioning, so 2022 will be one of the good years for our business.