Advanced Packaging and heterogeneous integration of ASM content from CEIA electronic intelligence experts think tank Li Yang teacher, Li Yang has been engaged in packaging technology for many years, and has a number of books related to advanced packaging technology.

This content is applicable to all designers and project leaders in the industry who are interested in advanced encapsulation, heterogeneous integration, SIP technology, as well as seeking a system miniaturization, low power consumption, high-performance solutions for the scientific research workers and engineers, welcome readers in the comments area. True insight, always worth sharing; like-minded people, there will always be predestined to meet. On December 24, a large-scale technology exchange forum for the Electronics Manufacturing Industry will be held in Changsha. The closing 2021 will be dedicated to bringing together the three outstanding people from Hunan, enabling them to advance their knowledge and build a comprehensive electronic assembly, insight into advanced packaging, covering hot topics such as intelligent MES system, precision dispensing coating, chip recording, 0201 component solid-state assembly, cavity-free welding, manual welding, special-shaped component plug-in, three prevention and cleaning, application of domestic electronic materials, potential of advanced packaging technology, etc. , we’ll see you in Changsha for the big event! (click on the photo above to sign up and view the details of the conference to win the Grand Prize)