The application of 3DSensing technology, which is capable of three-dimensional recognition of people or things in ASM camera packaging equipment, will expand in the smartphone market. Smartphone component manufacturers have tried to promote the commercialization of 3D Sensing technology.

According to industry news on November 3, Austrian sensor manufacturer AMS recently decided to develop a 3D depth sensing solution for mobile phones with Qualcomm Technology. AMS plans to combine light source (VCSEL) and optical imaging technology with Qualcomm's Snapdragon platform to develop a reference design for 3D Sensing.

Reference design refers to the design standard recommended by the manufacturer. Combine the Qualcomm application (AP) that plays the role of the smartphone's brain with AMS's sensor technology to externally sell smartphone solutions and platforms that can realize 3D Sensing. Android smartphone manufacturers are its target customers.

Alexander Everke, CEO of AMS said, "We expect to be able to quickly achieve commercialization and provide high-quality 3D sensing solutions for Android-based smartphones and mobile devices. ", and said, "We will simultaneously develop Active Stereo Vesion, structured light (SL), and TOF (Time-of-Flight) technologies. "

South Korean camera module manufacturers are preparing 3D Sensing modules one after another. Samsung Electronics is promoting the 3D Sensing module of the TOF method on some of the 5G smartphones and Galaxy A models that will be launched next year. Samsung Electro-Mechanics and Partron also participated in TOF module development.

TOF is a 3D recognition technology that measures the elapsed time of the light source irradiated by the subject and calculates the depth. Compared with the structured light (SL) technology applied from Apple iPhone X (face ID), TOF is considered to be an upgraded technology in terms of accuracy and distance measurement. TOF image sensors are only mass-produced at Infineon and Sony globally.

LG Innotek is preparing to supply TOF Sensing module to Apple. It is said that Apple will be equipped with TOF sensor on the new iPhone launched next year.

Because it is placed on the back of the mobile phone, 3D Sensing, which will appear next year, will be able to achieve augmented reality and virtual reality functions and become the focus of attention. Because it can measure not only the distance, but also the space, it will be possible to arrange virtual furniture in a specific space.