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ASMPT Automatic Die Bonding System

2023-12-19 17:37:21
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ASMPT Automatic Die Bonding System
Content:

AD50PLUS ASMPT Automatic Die Bonding System


Feature


●High-speed and high-precision die bonding


●Double welding head system


●Fully automatic material handling capability


●Laminate feeding (option)


●Automatic wafer loading and unloading system (option)


●Multifunctional image recognition system


●Windows® operating system and graphical user interface



Size


Width, depth and height


1570 x 1160 x 2075 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen