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ASMPT Automatic Die Bonding System

2023-12-19 17:40:02
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ASMPT Automatic Die Bonding System
Content:

AD50Lite ASMPT Automatic Die Bonding System


Feature


●Dry die cycle only: 47ms


●According to ASMPT internal testing standards


●Excellent bonding performance


●XY position accuracy: ± 38.1 µm (± 1.5 mil)


●Chip angle accuracy: ± 5°


●Small chip processing capacity-as small as 4mil


●Save production cost


●Using linear motors, greatly saving maintenance costs


●Power saving, low energy consumption


●High production area ratio, more effective use of plant space


●Fully automated production, saving human resources


●Automatic material handling capacity


●Longer MTBA



Size


Width, depth and height


1160 x 1040 x 1480 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen