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ASMPT Die Bonder and Flip Chip Bonder

2023-12-19 17:42:00
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ASMPT Die Bonder and Flip Chip Bonder
Content:

NANO ASMPT Die Bonder and Flip Chip Bonder


Feature


●Accuracy ± 0.3 µm @ 3s


●Support all die bonding and polycrystalline applications


●High-precision alignment of optical components


●Vibration reduction system


●Automatic placement and offset adjustment system


●High-precision 300 mm die bonding table


●Dynamic calibration system


●Quantitative parallelism calibration


●In-situ eutectic bonding ability


●Three different heating options, including laser welding system


●Active die bond strength control, from 0.1 to 20N


●Glue/spray glue solid crystal


●UV curing function is provided on the solid crystal table


●Post-bonding inspection and wafer positioning software


●The clean room is equipped with HEPA filter and static eliminator


●The machine is designed in modular form



Size


Width, depth and height


1690 x 1430 x 2040 mm

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen