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ASMPT Automatic Soft Solder Die Bonder

2023-12-19 17:42:07
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ASMPT Automatic Soft Solder Die Bonder
Content:

Lotus-SD Plus Automatic Soft Solder Die Bonder


Feature


High-speed die bonding: up to 6,500 per hour*


Large 8” wafer processing capacity


Single-row lead frame processing capacity


Excellent production quality


Programmable temperature control zone


Intelligent heating rail design


Adopting the design of rotating nozzle to make corrections synchronously during die bonding



Size


Width, depth and height 1823 x 1200 x 2057 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen