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ASMPT automatic wire bonding machine

2023-12-19 17:45:12
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ASMPT automatic wire bonding machine
Content:

AB383 ASMPT automatic wire bonding machine


Feature


●LED dedicated high-speed wire bonding machine system


●New hardware architecture, easy to maintain


●High resolution of welding head, accuracy can reach 40nm


●Innovative EFO box body uses segmentation to form sparks

●Better FAB shape control


●New concept tip design


●Preset gold wire (Au) wire bonding device, upgradeable optional copper wire (Cu) / alloy wire (CuPd) / silver wire (Ag) wire bonding device



Size


Width, depth and height


W: 820mm x D: 840mm x H: 1810mm

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen