AB383 ASMPT automatic wire bonding machine
Feature
●LED dedicated high-speed wire bonding machine system
●New hardware architecture, easy to maintain
●High resolution of welding head, accuracy can reach 40nm
●Innovative EFO box body uses segmentation to form sparks
●Better FAB shape control
●New concept tip design
●Preset gold wire (Au) wire bonding device, upgradeable optional copper wire (Cu) / alloy wire (CuPd) / silver wire (Ag) wire bonding device
Size
Width, depth and height
W: 820mm x D: 840mm x H: 1810mm