
iHawk AERO For Low Pin Count Discrete Applications
Feature
Excellent wire bonding ability
●30% UPH improvement
●Based on typical copper wire applications
●22μm wire bond ball
●Expert-level skills, in the case of 0.5mil wire, the wire bond ball can be as small as 22μm
●High-end applications of ultra-fine 30μm solder joints
Size
Width, depth and height
1,220 x 990 x 1,760mm³