
AD832i Automatic Die Bonding System (8” wafer handling)
Feature
●Ultra-micro dispensing capability
●Ultra-small wafer processing capacity
●High-density lead frame processing capability
●Patented welding head design
●Double glue system
●The new IQC system provides real-time graphical statistics
Size
Width, depth and height
1,740 x 1,350 x 1,506 mm³