
AD50PLUS ASMPT Automatic Die Bonding System
Feature
●High-speed and high-precision die bonding
●Double welding head system
●Fully automatic material handling capability
●Laminate feeding (option)
●Automatic wafer loading and unloading system (option)
●Multifunctional image recognition system
●Windows® operating system and graphical user interface
Size
Width, depth and height
1570 x 1160 x 2075 mm³