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ASMPT Automatic Die Bonding System

2023-12-19 17:55:39
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ASMPT Automatic Die Bonding System
Content:

AD50Pro ASMPT Automatic Die Bonding System


Feature


●High-speed die bonding: 50 ms die bonding cycle*


●Excellent bonding performance


●XY position accuracy: ± 25 µm @ 3σ*


●Chip angle accuracy: ± 3° *


●Small chip processing capacity-as small as 3mil


●Save production cost


●Directly send the film, save the cost of the carrier


●Using linear motors, greatly saving maintenance costs


●Power saving, low energy consumption


●High production area ratio, more effective use of plant space


●Fully automated production, saving human resources


●Automatic material handling capacity


●Automatic wafer loading and unloading system (option)



Size


Width, depth and height


1570 x 1160 x 2057 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen