AFC Plus ASMPT Die Bonder and Flip Chip Bonder

Feature

●The precision of die die and poly die machine is ±1µm @ 3S

●Die die cycle <15 seconds

●Chips and micro-optical devices (WDM, optoelectronic devices, micro lenses, micro machines)

●Automatic loading of substrate wafer

●Glue/spray glue solid crystal

●Using eutectic die bonding by laser or heating plate

●Passive alignment

●Options

●Poly Crystal Bonding

●Wafer positioning

●Inspection and measurement after die bonding

●UV curing

Size

Width, depth and height

1690 x 1430 x 2040mm