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ASMPT Automatic Clip Bonding System

2023-12-19 17:54:13
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ASMPT Automatic Clip Bonding System
Content:

eClip Plus Series Automatic Clip Bonding System


Feature


●One-stop solution from die bonding, clip welding to reflow


●Using patented welding head design


●Double glue system


●Matrix clamp welding capability


●Independent temperature control area


●Optional


●12" wafer processing


●Flip Chip Bonding


●Polycrystalline die-bonding



Size


Width, depth and height


3,450 x 2,200 x 2,080 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen