
eClip Plus Series Automatic Clip Bonding System
Feature
●One-stop solution from die bonding, clip welding to reflow
●Using patented welding head design
●Double glue system
●Matrix clamp welding capability
●Independent temperature control area
●Optional
●12" wafer processing
●Flip Chip Bonding
●Polycrystalline die-bonding
Size
Width, depth and height
3,450 x 2,200 x 2,080 mm³