ASM IC package equipment slider life

For semiconductor (non-LED) IC packaging, which die bonder and wire bonder are cost-effective and stable? How about ASM, ESEC and KNS? Thanks!

The key is to look at the characteristics of your product. In general, ESEC/ASMDiebond machines are OK, ESEC is more stable. KnS/ASMwirebond machines are now mainstream models. KnS has better wire arc control. For complex wire and arc products, it is better to use new KnS models.

What are the semiconductor packaging equipment? High precision, high speed and high yield are required.

At present, the mainstream semiconductor packaging equipment is semiconductor, Xinyichang, ASM, etc. Among them, semiconductors are more in line with the high precision, height and high yield required in the problem. Continuity continuously improves and improves the precision, speed and yield of die bonding in these three levels. The precision can reach the position error of die bonding <±, the angle error <0.5°, the speed can reach /H, and the yield rate can reach 99.99%.

Is the leader in packaging process technology, what are the well-known packaging process equipment?

It is a leader in the field of packaging process. It has created the 3C die-bonding rule to standardize and solve the technical problems encountered in the packaging process. At present, the main well-known equipment product is the die-bonding machine, and there are mainly three types. Crystal machine, double swing arm die bonder, high precision die bonder.