ASM Wire Welding Machine Academy, Asm Pacific Science and technology in partnership with APS, development of the first “Made in Hong Kong”Silicon Carbide (SiC) power module for electric vehicles the “Three tech elite”joined hands to help accelerate the adoption of electric vehicles in the region April 21,2006, hong kong-based Hong Kong Applied Science and Technology Research Institute (Astri or Astri) , ASM Pacific Technology Limited (“ASMPT”) and Innovation Power Technology Limited (“APS”) announced that, to jointly develop the industry’s first “Made in Hong Kong”Silicon Carbide (SiC) power module (IPM) for electric vehicles (evs) . Drivers are replacing silicon transistors, which are crucial for the next generation of electric vehicles because of their low resistance, high speed switching and excellent thermal performance in high power applications. Significantly smaller and more efficient power systems can solve the “Range anxiety”problem of electric vehicles and improve the overall vehicle performance design. It is expected that the development will also drive the development of electric vehicles by the Hong Kong government. The Hong Kong government announced in the 2021 that it would stop newly registered fuel private cars (including hybrid vehicle) in 2035 and require newly registered private small and medium private cars to be electric vehicles. The public sector will vigorously promote electric vehicles and achieve zero emission for all vehicles by 2050 and further improve air quality by 2050.The collaboration of the three key players the collaboration of the three key players reflects the spirit of collaboration between the private sector and local technology organisations. The promotion and development of the first “Made in Hong Kong”IPM will contribute to the re-industrialisation of Hong Kong and the creation of a high-end Semiconductor industry ecosystem in the bay area of China. Has Been Focusing on electronic module of the innovative packaging technology and power electronics technology. In order to develop the “Made in Hong Kong”mosfet-1 power module, the core research team is formed. The research and Development Project will focus on the integration technology from primary solid crystal to high-precision multi-component solid crystal. The project will be carried out at ASTRI'S 3D system packaging laboratory and at ASMPT’s high Power devices laboratory (Power Lab) . Power Lab leads the market in high performance SIC IPM complete solutions including printing, high precision solid crystal configuration, silver sintering, heavy aluminum wire welding and so on. The three partners bring strong complementary advantages. Is A leader in advanced semiconductor applications technology and has been focused on developing a new generation of advanced semiconductor technology solutions, including 3D integrated power electronics for the construction of high power SIC modules.Is a local 3rd generation semiconductor Silicon Carbide power device manufacturer with high performance “SiC”transistor technology and design capabilities to help electric vehicles operate with better battery life and efficiency. It also has a strong SIC Mosfet in-house development capability and has established strong relationships with electric vehicle manufacturers in the region. Semiconductor package is a leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing with more than 1,000 semiconductor package patents covering ultra thin chips, ultra high density welding and third generation semiconductor package technologies. ASMPT has a strong technical, process and design knowledge, including a full range of automotive electronics packaging solutions, obtained through collaboration with a wide range of customers in the industry. Crucially, ASMPT will provide an important silver sintering solution for the project through the Silversam tool. Its patented anti-oxidation and uniform pressure control technology ensures high-strength sintering quality, which can not only meet the basic requirements of heat conduction and electric conductivity, but also increase the density of IPM chips and prepare for the emerging demand of copper sintering, best cost-effectiveness and superior high power performance with SIC modules.The chief executive officer of Astri, Dr Ye Chenghui, said, “Astri is committed to developing solutions for the next generation of advanced semiconductor technologies, the successful manufacture of the ‘made in Hong Kong’silicon carbide power module for electric vehicles will not only bring about a breakthrough in the development of electric vehicle manufacturing in Hong Kong, but also promote the re-industrialisation of Hong Kong, to contribute to the road map for the popularization of electric vehicles in Hong Kong. Dr Daniel Shi, Senior Director of integrated circuit and systems technology, said: “ASTRI is pleased to work with ASMPT and APS on the third generation semiconductor technology project.”. For the first time, we have partnered with a Hong kong-based semiconductor ream and downstream company to bring together their respective innovative technologies for the project and jointly develop high-performance, high-power SiC electronic modules, which will promote new power-driven technologies, to support the upcoming popularity of electric vehicles and to launch a new chapter in the re-industrialisation of Hong Kong. “The APS is looking forward to working with Astri again,”said Mr. Tony Chau, chief executive officer of the company. “We will provide our latest SIC MOSFET chip for the project. APS is the first 6 inch SIC power device manufacturer in Greater China, and is a leading silicon carbide company in the fields of charging posts, PV, energy storage, electric vehicles, etc. . Power semiconductor device is a leading silicon carbide company in the world. We are confident that through this collaboration with Astri and Asmpt, we will be able to contribute to Hong Kong’s re-industrialisation and local semiconductor development.Mr Nelson Fan, vice president of advanced packaging business development, said, “We are proud to be working with Astri and APS to develop the high-performance SiC IPM project. Through the collaboration of the ‘top three’, we will continue to inject new impetus into the re-industrialisation of Hong Kong, the development of the Grand-Baie region of China and the development of third generation semiconductors. ASMPT will provide the necessary experience and resources, together with our key silver sintering equipment and expertise, to help ‘made in Hong Kong’power modules achieve mass production capability. The government announced last year that it would draw up a road map for the popularization of electric vehicles in Hong Kong, under which newly registered private cars, including hybrid vehicle vehicles, would cease to be fuel-efficient by 2035, the government will also update its green procurement policy.
Metal Oxide Semiconductor field effect transistor, a kind of semiconductor. In automotive applications, Mosfet is used in a variety of automotive systems, including body electronics, powertrain, chassis and safety, automotive security, electric drive drainage, and infotainment systems. On Hong Kong Applied Science and Technology Research Institute, the Hong Kong Applied Science and Technology Research Institute (Astri) was established by the Hong Kong Special Administrative Region government in 2000 with the mission to enhance Hong Kong’s competitiveness through applied technology research. ASTRI'S MAIN R & D areas can be grouped into four technical divisions: trusted and artificial intelligence technologies, communications technologies, Internet of things sensing and artificial intelligence technologies, integrated circuits and systems. R & D is mainly applied in six key areas: SMART CITY, financial technology, smart manufacturing, digital health technology, application-specific integrated circuit and the meta-universe. Over the years, astri has strived to nurture research and innovation talents and has won international awards for its technological innovation and oanding contributions to the business community and the community. As of 2020/21, astri has transferred nearly 800 technologies to the industry and awarded over 900 patents in mainland China, the US and other countries.About ASM Pacific Technology Limited (“ASMPT”Hong Kong Stock Exchange Code: 0522) is a leading global supplier of hardware and software solutions for semiconductor and electronics manufacturing. Based in Singapore, ASMPT offers products ranging from semiconductor assembly and packaging and SMT (surface-mount technology) , from wafer deposition to solutions that help organize, assemble and package sophisticated electronic components, for customers to use a variety of end-user equipment, such as electronics, mobile communications equipment, computing equipment, cars, industry and LED (display board) . Working closely with our customers, ASMPT continto invest in research and development to develop cost-effective and industry-driven solutions that contribute to increased productivity, reliability and quality. It is a component of the Hang Seng Technology Index, the Hang Seng composite medium-sized index under the Hang Seng Composite Market Value Index, the Hang Seng Composite Information Technology Index under the Hang Seng Composite Industry Index and the Hang Seng Hong Kong 35 index. For more information, check out ASMPT’s website on Alpha Power Solutions Limited (“APS”) , China’s leading third-generation semiconductor supplier specializing in silicon carbide device development, manufacturing and sales.
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