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ASM IC PACKAGING EQUIPMENT PACIFIC TECHNOLOGY: constantly adjust the development direction of advanced packaging technology

2022-04-15 11:24:50
Times

ASM IC packaging equipment Pacific technology: changing the direction of advanced packaging technology, the global semiconductor industry has been through a lot in 2021. On the one hand, the ever-spreading chip shortage has brought great trouble to the whole semiconductor industry and great challenge to the global semiconductor ecosystem. On the other hand, the rise in demand for semiconductor products related to telecommuting, accelerated growth in data centers, artificial intelligence, 5G communications, and new energy vehicles has helped fuel the Semiconductor industry boom. How will the Semiconductor industry develop in 2022? When can global supply chain shortages be alleviated? How can governments promote support for Semiconductor industry development? These are the concerns of the industry. “Semiconductor Chip Technology”magazine Special Launch-“New Year Outlook (2022 Outlook)”interview, invited to Asm Pacific Technology Co. , Ltd. , xu Zhiwei, vice president and Fan Junhao, shared their analysis and views on these issues.About ASM Pacific Technologies, Inc. (ASM Pacific Technologies, Inc.) is a global supplier of integrated and packaged equipment for the semiconductor and light-emitting diode industries, provides assembly equipment and materials (etched and stamped lead frames) for multinational chip manufacturers, independent integrated circuit (IC) assembly plants, consumer electronics and LED manufacturers. Founded in 1975 and listed in Hong Kong in 1989, the company now operates in more than 30 countries and regions worldwide and employs about 16,000 people. We have excellent research centers in Hong Kong, Taiwan, Chengdu, Singapore, Munich, Weymouth, Bringen, Portugal and other places. We also have advanced and intelligent manufacturing centers in Longgang, Shenzhen, Bao'an District, Guangdong, Hong Kong, Singapore, Malaysia and Germany. In 2011, ASMPT acquired the surface Mount Technology (SMT) Division of Siemens AG in Germany, in 2014 it acquired the UK’s Dek stencil printing technology and the Netherlands’ALSI laser technology, and in 2018 it acquired the German technology company Amicra in Regensburg, the Portuguese developer of Critical Manufacturing software and the acquisition of the electrochemical deposition and Physical vapor deposition equipment in the Nexx Unit of Tel SEAS. In semiconductor integration and packaging equipment market, SMT solutions, radio frequency applications market, lead frame industry and other areas of global leadership and provide one-stop interconnection solutions.According to the interviewer, Xu Zhiwei has been with ASM Pacific for 25 years and has held key positions in the technology and marketing departments respectively. Since 2006, he has focused on the business development of IC/D semiconductor market in China. He has established extensive customer contact network in the fields of IDM, OSATS, Fab and Fabless. With a deep understanding of the IC market, such as logic IC, analog IC, power IC, memory, MEMS, sensors, he is also actively involved in the company’s equipment development planning and process development. He received a Bachelor of Science degree in physics and mathematics from the University of Hong Kong and a Master of Science Degree in physics from the Hong Kong University of Science and technology. ASM Pacific Technology Co. , Ltd. , Xu Zhiwei Vice President (IC/D semiconductor solutions, questionsAnswer: Please look forward to 2022 the development prospect of global semiconductor industry. Was a very special year for the semiconductor industry, driven by the new crown epidemic and sino-us trade war-driven localization of the combined impact of development. New Technologies and market forces have also opened up new demand cycles -- 5G brings new market opportunities for electric and driverless cars, big data + data services, high-performance computing, data centers, artificial intelligence, the meta-universe, and the artificial intelligence Internet of things (Aiot) . New Material Technologies such as third-generation semiconductors (SiC, Gan, etc.) will enhance IGBT performance, and supply chains and wafer supplies are expected to remain tight in 2022, all of which will continue to dominate global semiconductor development in 2022. : What challenges do you think China’s semiconductor industry is facing? In recent years, China has recognized the importance of the Semiconductor industry to achieve self sufficiency in the future. More investment and government support would help to accelerate the pace of development. Of course, China’s semiconductor development in the next few years may still have some challenges. Wafer technology, which limits the import of lithography equipment (such as ASML) , makes it difficult for China to break through the technology of wafer nodes below 10nm, which is very important for advanced logic ics. China needs to make more efforts to achieve the same effect through advanced packaging (such as 2.5 d, 3 d) . Design, software licensing, and intellectual property are controlled by the United States (such as Cadence, Synopsys, and Mentor Graphics) . List of semiconductor materials, for example, is more dependent on Japan and South Korea.Talent and resources, the Chinese market in advanced logic IC, CPU/GPU and memory areas lack of experience experts, how from technology to management and development of advanced IC’s core team in China may take some time. Overcapacity, according to the national localization plan, power supply, analog IC devices, consumer products applications and other low-and medium-end areas will flourish in China, how to avoid the loss of value (and low profits) caused by overcapacity will be a key issue. High-end segment market, limited by the above factors, how to break through 5g/6g, electric vehicles, self-driving cars, AI and other fields, need a lot of advanced IC support, to win over the world’s major players need time. : Combined with Your Business, what do you think the supply chain will face in 2022? Shortages will continue, even if conditions are better than 2021. CUSTOMERS: Wafer shortages, supply constraints for lead frames and substrates are major barriers to capacity expansion. Inside: Long Lead Times for key components such as linear motion guides and motors will be a challenge for equipment suppliers. : How do you think you can fully benefit from the state’s support policy for the semiconductor industry? How does it Guide Your Business Development? On the one hand, we see the government encouraging more local competition, which is our impetus to accelerate our development and win in the market. On the other hand, we can use more local resources to strengthen our made in China, train more local talents, make full use of our China R & D Center (ATC) in Chengdu, and cooperate with local market leaders and the China Semiconductor Association, this is very important for our future development.: With the rapid development of 5G, AI, Iot and driverless technologies in recent years, what are the new requirements or challenges for semiconductor manufacturing and packaging technologies? How do you respond to these new requirements? All of these technologies require more advanced IC computing power, as well as advanced wafer technology. CPU/GPU/MCU is the key element of 5g/6g and AI technology, which makes it fully play the characteristics of high-speed, real-time and low-delay in the field of Internet of things, self-driving vehicle and AR/VR. According to Moore’s law, wafer nodes are approaching their limits, and advanced packaging (such as 2.5 d, 3 d) will become more and more important in the future packaging roadmap. This is the strength of Asm Pacific Ocean and the development focus in recent years, such as as as TCB, 2.5 d/3d high precision welding, laser application, RDL, PVD/ECD and so on. : What is Your Market Plan for 2022? China: is committed to the high-end market and the car market customers grow together. Working with leading players in advanced packaging (TCB, 2.5 d/3d) , logic (such as CPU, GPU, etc.) , and memory components, provide Asm Pacific complete solution xnexx ECD/PVD, laser cutting (ALSI) , solid crystal, solder wire, plastic seal, test, SMT complete solution. Overseas: working closely with IDM, Wafer FAB and chip design company to develop new packages. : What is your technology or product plan for 2022? FIREBIRD, Nucleus, ORCAS, solid-crystal wire for memory solutions, and third-generation semiconductor silver sintering solutions such as SIC.: Looking back at the 2021, how did the whole semiconductor industry develop? What have you achieved? We have achieved significant growth (revenue more than doubled) in the IC/SEPERATE component market and have successfully expanded our market share in the following areas: China’s major, Chinese memory manufacturers, the power packaging market, IDM, OSATS and domestic customers, automotive market, especially China Electric Vehicle Market, power modules, silver sintering solutions, laser solutions (slotting and cutting) provide IDM with TCB and NEXX solutions, expanding 2.5 d/3d solutions in IDM & amp; Fab House’s market share picture, interviews with guests, Mr Fan Junhao has been in the semiconductor industry for more than 30 years. He has held senior management positions at IDM/OSAT in Hong Kong and was the founder of a cooling technology company, and holds more than 40 patents related to semiconductor package technology. He was a graduate of the University of Colorado Colorado Springs and enrolled in the electronic engineering program.

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      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

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