How does the new laser technology of ASM IC packaging equipment achieve both yield and capacity? Once again, the topic of 2021 has become a hot topic in the industry. Powerful giant color, Abison, lanpu video and other screen factories are Micro-flag LED, coupled with the previous has proposed Micro LED manufacturers, you can see, LED display field towards Micro LED. From the vertical end of the industrial chain, chips, packages, and downstream displays are all heavily invested in minicomicroleds between 2020 and 2020, according to industry experts who say the 2021 did not fully account for last year, the cumulative investment in Mini/Micro leds is close to $70 billion. There are signs that the Mini/Micro LED era is just around the corner for leds. The Mini LED direct display chip is a flip chip with a long side smaller than 250 Um, while the Mini LED backlight chip is a flip chip with a long side smaller than 400 Um, according to the definition in & Snow Intelligence's miniaturized LED era, market and Technology Assessment Study A Micro LED is a chip with an area of less than 5000um? And stripped off the substrate of the LED chip, you can see, Mini LED chip and Micro LED chip compared to the traditional LED chip, greatly reduced in size. Led chip size reduction, means the same size wafer cutting out of the number of chips increased significantly, cutting times also increased. At the same time, the LED chip size reduction also means that the process of cutting error tolerance is lower and lower, the precision requirements are higher and higher. But for ordinary equipment, there is usually a trade-off between yield and efficiency. If the pursuit of yield, improve the precision of cutting, cutting speed to reduce the efficiency is difficult to improve. If the pursuit of output, that is, in the unit time to increase the number of cutting, it is difficult to avoid cutting accuracy will reduce, so that the high yield of products is difficult to ensure. Therefore, if the industry wants to enter the MINI/MICRO LED era as soon as possible, Mini/Micro LED products to the market on a large scale, the indispensable equipment is the need for both yield and output of laser dicing machine, to meet the needs of the industry must have both fish and bear's paw. For this industry pain point, Asm Pacific launched its own research and development of LS100-2 fully automatic laser dicing machine, every hour can cut out about 10 million chips. LS100-2 patent VS traditional laser cutting technology, first look at the LS100-2 FULL-AUTOMATIC LASER dicing machine related parameters: CUTTING DEPTH ACCURACY: ≤1um XY CUTTING POSITION ACCURACY: ≤0.7 um cutting width: ≤14um Wafer Diameter: 4"/6"Wafer Thickness Change: & Lt; 15um Table: 168mm, 260mm, 290 ° (x, Y, LS100-2 full-automatic laser dicing machine used dry processing, no cleaning. The device uses ultra-short Pulse laser to achieve patented semi-surface cutting technology, so the LS100-2 can do thin wafer cutting, such as Mini LED, Micro LED and so on. In addition, LS100-2 can realize ultra-high speed laser cutting, especially the laser cutting of small size chips, based on the ASM Pacific's patented dual-stage design and multi-scratch laser cutting technology. Sentence is too long, please supply a shorter sentence. The ASM Pacific's LS100-2 fully automatic laser dicing machine, which has been certified by first-line U. S. customers, is being used to mass-produce Mini leds, according to industry experts. In addition, Asm Pacific is actively developing laser applications, the future will increase the Mini LED automatic laser repair process and other applications. Experts say the Industry Research Center believes that one factor that should not be overlooked in mass production of MINI/MICRO LEDS is cost. For LED manufacturers, equipment is an important fixed asset investment, and Depreciation affects the size of the cost. At the same time, the yield and output of the equipment are two key factors to determine the size of the production cost. Therefore, the selection of equipment should be cautious and careful, the need for a comprehensive evaluation of equipment.