What are the common problems of ASM automatic die bonding machine? Here are five categories for you:

1. Missing chip catch

The automatic die-bonding machine exhibits chip missing grasping, what is the manifestation of chip missing grasping?

1. Can't grasp the chip;

2. Able to pick up the chip, swing the lost chip;

3. There is a chip on the suction nozzle, and the device generates a false alarm, which reduces the sensitivity of the device and increases the value on the die bond detection board.

2, the nozzle is blocked

The reason for the blocking of the suction nozzle of the automatic die attaching machine is very simple:

1. There is a foreign body blockage on the suction nozzle, and the suction nozzle needs to be cleaned in time;

2. The sensitivity of the die-bonding detection board is too low. Reduce the value above and add sensitivity;

3. The height of the die is not good or the cup is tilted, which causes the wafer to not be fixed. This situation is more common. You can lower the height of the reset cup to adjust the die height.

3. Improper orientation of solid crystal

The reasons for the incorrect orientation of the automatic die bonder are as follows:

1. The die height is too low, and the pressure is too high to cause the wafer to slide. The solution is to increase the die height;

2. The cup, especially the aluminum plate, is unstable or not placed flat, clamp the aluminum plate or reset the cup position to make it flat;

3. The PCB identification delay is too small, and the increase is delayed;

4. The height of crystal mining is not good, so lower the height of crystal mining;

5. The rising height of the thimble is too high or the top is inclined, lower its rising height or adjust its position (the damage of other thimble will cause foreign matter under the chip to make it hard to fix);

6. The suction nozzle is partially worn out, replace the suction nozzle.

4, the dispensing is not correct

The manifestation of the incorrect dispensing of the automatic die-bonding machine is as follows:

1. The dispensing position is offset, and the conditioning glue is offset;

2. Adhesive dispensing head, scrub the dispensing head;

3. The dispensing head or dispensing arm is loose, tighten both;

4. The delay of dispensing is too small, and the increase is delayed, especially when the swing arm is lowered to take the glue. In addition, if the glue is relatively thick, the glue can be turned on and the end of the glue can be broken.

5, the automatic die bonding machine wrongly searched for PCB

The automatic die bonder searched the PCB incorrectly, causing the jumper and the chip to be stacked, and the PCB was re-arranged. The punctuality of the material erection is that the relative positions of the two material racks to the top cup position are as close as possible, or the search scale is reduced. Need to expand the search scale or correct the cup position and skip.