ASM wire bonding machine takes you to understand the bonding process settings:

The setting of bonding process includes setting control of bonding temperature, bonding time and heating speed.

Temperature has two effects on the thermal movement of molecules. One effect is to activate the motor unit. The increase in temperature increases the energy of the thermal movement of molecules. When the energy is increased enough to overcome the barrier required for the movement of the movement unit in a certain way, the movement unit is in an activated state, thus starting a certain way of thermal movement. Another effect is that the increase in temperature causes the polymer to expand in volume, which increases the free space of molecules. When the free space reaches the size necessary for the movement of a certain moving unit, the moving unit can move quickly. As the temperature increases, the results of these two effects accelerate the relaxation process, or in other words, shorten the relaxation time. If the temperature of the polymer system increases, the relaxation time of the moving unit is shortened.

Setting of bonding temperature: In the early stage of the development of bonding powder, the control accuracy of the equipment was poor, and the foundation powder was not specifically designed. Bang often closes the tank regularly. Therefore, the bonding temperature is generally set below Tg ("point A" in Figure 4), so the problem of cylinder formation is solved, but from the perspective of the thermal motion of the molecule, the macromolecular segment does not move, and the bonding effect is certain Poor; now, the precision and automation of the bonding equipment have been improved, and the foundation powder is also specially designed. The bonding temperature is generally set above Tg (between point A and point B in Figure 4). The inner powder is recommended to be set at 60°C to 70°C, and the outdoor powder is recommended to be set at 65°C to 75°C. The base powder and effect pigments are smoothly bonded under the movement of the molecular chain, and the bonding effect is better.

The time setting of the ASM bonding machine: It is based on the time required to complete the bonding of the base powder and the metallic pigment. Under the same Tg, the temperature of the foundation is ↑, and the relaxation time is ↓. Setting the bonding time corresponding to the characteristics of the foundation powder and the bonding machine equipment can prevent agglomeration and ensure the bonding quality.