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Bestsoon Electronic Technology Co., Ltd.

Tel: +86-755-23016560

Contact : Mr. zhao

Mobile : +86 139 2573 3686

Fax: +86-755-23016560

E-mail:sales@bestsoon-china.com

website:en.bestsoon-china.com

Address : 2202, 23rd Floor, Jinhao Building, No. 109, Fuyong Section, Guangshen Road, Fenghuang Community, Fuyong Street, Bao'an District, Shenzhen

What is ASM bonding machine? Understand the meaning of bonding machine

2020-07-25 09:03:22
Times

What is the ASM bonding machine?

What is a bonding machine? The bonding machine is a device for accurately positioning and bonding IC chips on LCD glass. The whole machine is composed of PLC + HMI control core. The automatic image alignment system PV310 completes the calculation of the alignment data of the target object. After finishing the alignment and pre-compression of the product, the product will be transferred from the platform to the local pressure for bonding and crimping.

1. The bonding machine adopts PLC control system, platform servo drive positioning, constant temperature heating method, and stainless steel thermal head realize constant temperature crimping. The bottom alignment method is used to crimp the IC. The product MK points are clear and automatically aligned.

2. After setting the equipment parameters according to the product requirements, the equipment will automatically produce according to various indicators.

3. Set according to the different temperature, time, pressure and other data required by the product to provide production data.

4. The bonding machine system automatically detects various functions of the equipment, and displays and sends out an alarm when the equipment fails.


ASM Bonding Machine


5. The software decomposes and executes various mechanical actions of the equipment, suitable for manual production for equipment debugging.

6. Password setting and password modification can be performed to enhance the confidentiality of product data and unified management of equipment.

7. The bonding machine does not require the operator to conduct temperature testing through the instrument, and the system will automatically detect and set it.

8. In the operation interface, the system will display the running status of each component and the fault alarm display.

9. The use of dual-start system and emergency stop switch can make the production process safer.

10. The bonding machine system can automatically store the location of each IC, and can automatically go to the IC location to be repaired as needed during the operation.

11. You can edit and store 20 product parameters in advance, and you can call them directly next time without setting them again.

12. It can store 50 kinds of IC tray data in advance, which can be called directly when in use.

13. The complete machine of the bonding machine has an automatic reset function, which can ensure that it can be automatically reset to the working origin under any working conditions.


ASM binding machine: One-way welding can memorize the data of two lines, which is convenient for the left and right brackets to use the same side one-way welding.

In two-way welding, the height of the second inspection and the height of the arch wire of the two lines are respectively adjustable to facilitate the welding of brackets with different second welding heights.

A variety of arc-raising schemes are available, which can achieve any arc you want. Deep cup brackets and piranha brackets with higher arc requirements will greatly increase the pass rate.

The two-welding ball repair function can greatly improve the weldability of the two-welding and reduce the dead point rate.

Automatic film feeding is one-step or two-step selection. For brackets with large distances such as ф8 or ф10, choosing two-steps each time will greatly improve production efficiency.

Continuous film transfer function can improve efficiency for rework brackets.

The wedge detection function can detect whether the wedge is installed well, greatly reducing artificial false welding.

Ultrasonic power output in 4 channels can try to ensure that the two solder joints on both sides are basically the same. At the same time, because the solder joint parameters on the chip and the bracket are different, choose a different welding power on the chip and the bracket to ensure the solder joints on the chip It meets the requirements for welding with the fill ball on the bracket.

The ball burning performance is greatly improved. If the uniquely designed wedge of our company is used, a smaller first weld (ball weld) and a more reliable second weld can be obtained. It is more suitable for the production of blue and white light-emitting diodes.

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01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen