What should I pay attention to when using ASM automatic wire bonding machine?

The automatic wire bonding machine can be adjusted in all directions in a three-degree space, adopts digital temperature setting, and the welding temperature is clear at a glance. The automatic wire bonding machine can replace manual soldering work for various solder joints, such as spot welding and drag welding. The automatic wire bonding machine can replace the manual process to ensure product quality. It can also improve work efficiency, save labor costs, and the operation is very simple. The machine comes with a dedicated soldering program, the programming is simple and easy to learn, and it can easily adapt to changes in product models and production lines. The automatic wire bonding machine is small in size, does not occupy space, and is easy to operate. The temperature, wire feeding speed, and amount of tin can be adjusted. The automatic wire bonding machine is especially suitable for welding all kinds of electronic circuit boards, LED light strings, cable plugs, data cables, earphone cables, electronic components, etc.

Pay attention to the following matters when using the automatic wire bonding machine:

1. First select the appropriate solder. If soldering electronic components, low melting point solder wire should be used.　　

2. Then select the appropriate flux. The flux is generally 25% rosin mixed with 75% alcohol.　　

3. The method of soldering tin on the wire bonding machine is: first heat the electric soldering iron to a certain temperature, so that when it can just melt the solder, apply flux and evenly spread the solder on the tip of the soldering iron.　

4. Pay attention to the welding method of the wire bonding machine. First, use fine sand to coat the soldering flux on the pads and the lead pins of the component. Then use a soldering iron tip to take a small amount of solder to touch the solder joints. After the solder on the solder joints are all melted and immersed in the component leads, the soldering iron tip is gently lifted up and away from the solder joints along the pins of the components.　　

5. The welding time of the automatic wire bonding machine should not be too long, otherwise the components may be burnt. You can use tweezers to clamp the pins to help dissipate heat.　　

6. The solder joints of the automatic wire bonding machine should be in the shape of sine wave peaks, and the surface should be bright and smooth, free of tin thorns, and moderate tin quantity.　　

7. After the wire bonding machine is completed, the residual flux on the circuit board should be cleaned with alcohol to prevent the carbonized flux from affecting the normal operation of the circuit.　　

8. The integrated circuit should be soldered afterwards, and the electric soldering iron should be grounded reliably, or the residual heat should be used for soldering after power failure. Or use dedicated sockets for integrated circuits, and then plug in the integrated circuits after soldering the sockets.　　

9. The wire bonding machine should be placed on the soldering iron stand.