ORCAS Series ASMPT Encapsulation Solution for Large Format Packaging
Feature
●Independent packaging equipment, also suitable for die up and die down wafer level and substrate packaging
●Suitable for KOZ and overmold products
●Powder and liquid encapsulation resin can be used. Automatic control of dispensing and powder coating method, speed and shape, the accuracy can reach ±1%
●Use non-polluting separation film in the packaging to ensure that the mold is clean throughout the process
●Innovative technology is applied to the production line, fully automatic processing of 12-inch (without wafer ring) or 8-inch (with wafer ring) wafer products
Size
Width, depth and height
2470 x 4020 x 2230 mm³