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The Component Tacking Tool for Silver (Ag) Sintering

2021-03-24 11:05:49
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The Component Tacking Tool for Silver (Ag) Sintering
Content:

FORCE VECTOR The Component Tacking Tool for Silver (Ag) Sintering


Feature


● Wafer and component tracking for silver sintering process


●Silver film stamping


●Automatic processing of silver film for HVM


●Configuration of hot pressing (TC) die-bonding head


●The heating capacity of the die-bonding table


●High bonding strength


●Silver sintering material processing


●Flexible MCM function


●Ejector, pick-up and die attach nozzle


●Flexible chip and component input format: wafer | TnR | format tray | JEDEC tray


●Automatic tool change system


●Thin wafer handling capacity



Size


Width, depth and height


1750 x 2160 x 2260 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2202, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen