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ASM Automatic Die Bonder

2021-03-24 10:55:16
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ASM Automatic Die Bonder
Content:

AD800 ASM Automatic Die Bonder


Feature


●Super high speed: 50 ms cycle time


●Excellent bonding performance


●XY position: ±25 µm @3σ*


●Mould rotation: ±3°@3σ*


●Small mold processing capacity-as low as 3 million


●Large substrate processing capacity-up to 270 x 100mm


●Comprehensive quality inspection-defect inspection, before and after bonding


●Automatically skip units and molds, inking or poor quality


●Inspection before bonding-stamping quality


●Check after bonding-bonding performance


●Save ownership and production costs


●Linear motor saves maintenance costs


●Energy saving, low power consumption


●Higher UPH/occupancy ratio, improve the utilization of factory space



Size


Width, depth and height


1570 x 1160 x 2057 mm³

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Contact

01.png Company Name : 

      Shenzhen Bestsoon ElectronicTechnology Co., Ltd.

02.png  Contact number:+86-755-23016560

03.png  Tel:+86 139 2573 3686 ( Zhao)

            +86 137 9879 5391 ( Huang)

             +86 133 0291 7860 (Yang ) 

04.png Fax: +86-755-23016560

05.png E-mail:sales@bestsoon-china.com

06.pngAddress:2302, south side, 23rd floor, Jinhao building, Fenghuang Community, Fuyong Street, Bao an district, Shenzhen