AD800 ASMPT Automatic Die Bonder

Feature

●Super high speed: 50 ms cycle time

●Excellent bonding performance

●XY position: ±25 µm @3σ*

●Mould rotation: ±3°@3σ*

●Small mold processing capacity-as low as 3 million

●Large substrate processing capacity-up to 270 x 100mm

●Comprehensive quality inspection-defect inspection, before and after bonding

●Automatically skip units and molds, inking or poor quality

●Inspection before bonding-stamping quality

●Check after bonding-bonding performance

●Save ownership and production costs

●Linear motor saves maintenance costs

●Energy saving, low power consumption

●Higher UPH/occupancy ratio, improve the utilization of factory space

Size

Width, depth and height

1570 x 1160 x 2057 mm³