
AD210 Plus Automatic Die Bonding System (6” wafer handling)
Feature
●High welding position accuracy
●Substrate processing capacity can reach 8" x 8"
●Independent control of crystal fetching and die bonding process
●Patented welding head design
●UV fast curing system (option)
Size
Width, depth and height
2,150 x 1,400 x 2,300 mm